Find equipment by part number or task. Specifications, compatibility checks and supply terms are on each product page.
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 48 GB total · Modules per package: 2
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 48 GB total · Modules per package: 2
Photo pendingServer Premier module: 48 GB, DDR5, 5600 MT/s, UDIMM, ECC, 2R. Exact part KSM56E46BD8KM-48HM; platform requirements are checked before selection.
Photo pendingServer Premier module: 48 GB, DDR5, 5600 MT/s, SODIMM, ECC, 2R. Exact part KSM56T46BD8KM-48HM; platform requirements are checked before selection.
Photo pendingValueRAM module: 48 GB, DDR5, 5600 MT/s, SODIMM, 2R. Exact part KVR56S46BD8-48; platform requirements are checked before selection.
Photo pendingValueRAM module: 48 GB, DDR5, 5600 MT/s, UDIMM, 2R. Exact part KVR56U46BD8-48; platform requirements are checked before selection.
Photo pendingMemory module or factory-matched kit. Package and per-module capacity are separate; XMP/EXPO does not guarantee that speed on every platform. Package capacity: 24 GB total · Modules per package: 1 · Package Memory Format: SODIMM
Photo pendingMemory module or factory-matched kit. Package and per-module capacity are separate; XMP/EXPO does not guarantee that speed on every platform. Package capacity: 24 GB total · Modules per package: 1 · Package Memory Format: SODIMM
Photo pendingMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pendingMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pendingMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pendingMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pendingMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pendingMemory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: UDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Specification schematic, not a product photograph or installation drawing.Memory module or kit. Package and per-module capacity differ; check profile speeds, BIOS and platform compatibility. On-die ECC is not system-level ECC protection. Memory technology: DDR5 · Module form factor: CUDIMM · Package capacity: 24 GB total · Modules per package: 1
Photo pendingMemory module or factory-matched kit. Package and per-module capacity are separate; XMP/EXPO does not guarantee that speed on every platform. Package capacity: 96 GB total · Modules per package: 4 · Package Memory Format: UDIMM
Photo pendingMemory module or factory-matched kit. Package and per-module capacity are separate; XMP/EXPO does not guarantee that speed on every platform. Package capacity: 96 GB total · Modules per package: 4 · Package Memory Format: CUDIMM
Reference catalogue for quotation requests. Availability, production status, condition, price, lead time and warranty are individually confirmed. A listed part number is not a stock claim.
Photo source and licence ↗For businesses in Tashkent and Uzbekistan: component selection, specification review and supply. Send the part number, quantity and host model for a quotation.
Before ordering, confirm the exact part or model, package contents, interfaces, host limits, condition, warranty and supply terms against the product documentation.
